precision diamond wire saw is designed to provide smooth cutting or slicing for all kinds of materials, especially for larger size crystals, such as Si, Ge and GaAs, etc., up to 12" (300 mm) diameter. It cuts the crystal by a diamond impregnated wire (0.28 mm diameter) which moves repeatedly backwards and forwards with the help of a digital controller. STX-1202 is equipped with angle adjustable sample holder. Please visit our websites or contact Global Nanotech Equipment by e-mail for more information in detail.