TEL Deep Trench Silicon Etcher-TELIUS SP 308 QS

TEL Deep Trench Silicon Etcher-TELIUS SP 308 QS

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Manufacturer:Tel

Model:TEL Deep Trench Silicon Etcher-TELIUS SP 308QS

Condition:Used,complete,crated,working before crating.

Amount:3 sets

TEL Deep Trench Silicon Etcher Model: TELIUS SP 308 QS ETCH TOOL, (4) CHAMBERS, 5 loader ports, 300mm FOUP, Load Locker Modules,4 Deep Trench Silicon Etcher (SCCM) Super Capacitively Coupled Module Chambers,40MHz and 3.2MHz dual Frequency Source (GEW3040 and NOVA50A),ESD chuck, Temperature Control.

Specifications

1.&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; Chamber: Aluminum Alloy Chamber, Aluminum Alloy (A6061), Hard Sulfuric Acid Anodizing Surface finishing.

2.&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; RF application method: Apply upper RF to lower electrode, SCCM Type Discharge method.