PRODUCT BENEFITS ? More real estate and narrower street widths, because Zero kerf loss allows higher die density on the wafer ? Increased production rates ? Chip free results ? Less residual stress ? No toxic water discharge ? No D.I. water costs PRODUCT FEATURES Automatic ? Capable of completely and automatically scribing and breaking many substrate materials.< /span> Cost effective ? Reduced production time ? System integration allows easy hook-up and transport ? Superior yields and improved efficiency Environment al ? No D.I. or toxic wastewater Versatile ? Fully programmable for all scribing and breaking parameters, including TrueAngle? diamond tool positioning ? Infinitely programmable with Pentium? powered Windows? interface Easy ? Stored Process eliminates operator adjustments when changing between wafer types GST-150 SPECIFICATIONS Wafer Size: 150mm max. (6" max.) Wafer Thickness: 40 um to 1725 um (material
